Switzerland-based startup Corintis, which focuses on cutting-edge chip cooling technology, has secured $24 million in a Series A funding round. The funding will help the company scale up its microfluidic cooling systems, a breakthrough solution that’s already being tested by Microsoft—which reports performance that’s three times better than conventional methods.
The round was led by BlueYard Capital, and it comes at a time when cooling technology is becoming increasingly crucial. As processors grow more powerful, they consume more energy and generate more heat. Corintis is tackling this challenge head-on, working to overcome the thermal barriers that limit chip performance.
In a major boost to its credibility, Corintis has also added Lip-Bu Tan, the CEO of Intel, to its board. The company claims its cooling system can be up to 10 times more efficient than traditional solutions—potentially unlocking a new era for high-performance chips.
Growth and Vision for the Future
With the fresh funding, Corintis plans to grow its team from 55 to 70 employees by the end of the year and significantly increase production capacity. The company is gearing up to manufacture over a million microfluidic cold plates annually by 2026, with further growth expected as demand continues to rise.
Remco van Erp, co-founder and CEO of Corintis, emphasized the need for smarter cooling solutions. “Every chip is like a miniature city, packed with billions of transistors. The current approach—basic copper blocks with fins—just isn’t enough anymore,” he said.
Corintis takes a different route. Its solution uses custom-shaped micro-scale channels, designed specifically for each chip. These channels guide coolant precisely to the chip’s hottest areas, boosting performance and solving a key challenge for chip designers working under tight timelines.
Corintis already has momentum. Since its founding in 2022, it has shipped over 10,000 cooling systems and brought in eight-figure revenue. With early deployments already underway with major tech customers, the company expects that number to rise sharply in the coming years.
Its flagship platforms—Glacierware and Therminator—give chip designers powerful tools to optimize thermal performance. As the computing world demands more processing power, Corintis’ technology is emerging as a crucial part of that future.
“Cooling is one of the biggest challenges for the next generation of chips,” said Lip-Bu Tan. “Corintis is on the fast track to becoming the industry leader in solving this thermal bottleneck.”
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